SIM card bonding hot melt adhesive tape KH190

KH190 hotmelts 1.Good low temperature performance 2.Strong adhesive strength, good flexibility 3.Good weathering resistance

SIM card bonding hot melt adhesive tape KH190

 

 

 

Features

1.Good low temperature performance2.Strong adhesive strength & Good flexibility3.Good weathering resistance4.The adhesive is not liable to overflow5.With low requirements to the production and storage environment

Specification

Base layer	Glassine paper
Adhesive layer	Thermoplastic
Bonding strength	>880 pound/sq.in
Thickness	Base layer: 70±10μm Adhesive layer: 70±10μm
Temperature	Embedding temperature:  160~200°C Room temperature: -30~60°C
Duration	Bonding: >0.6s Setting: 5 minutes
Storage condition	Temperature: -30 °C ~ 40 °C Humidity: 30% ~ 50% Best before 12 months
Usage	Special design for IC module bonding

Note: All features mentioned above are result from the test results of different kinds of IC card implanting machine, chemical performance of this adhesive and the result of repeated and prolonged scientific experiment of Kesong Lab. 

About Us

Guangzhou Smarthand Technology Co., Ltd  was established in 1999 and has our own R&D. Our production is based on Guangzhou Kesong Magnetic Tape Co., Ltd.

We offer a range of products, including hot melt tape/film, special adhesive tape, glue, magnetic tape, steel plates, etc. Our products are widely used in smart cards, electronic tags, electronic parts & products, paper industry, etc. Now, we have developed into one of China's main manufacturers in this field.

We are a professional manufacturer ISO9001: 2008 certificated with high-quality caliber staff members, good workshop environment, enhanced management and advanced production equipment.  

For further information, please feel free to contact us.

SIM card bonding hot melt adhesive tape KH190